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FLY-801 T Top LED Wire bonder
Features
- Thermosonic high speed bonding, fast conversion
- Vision system: Programmable look ahead PR
- Multiple die and level bonding capability
- Ease of maintenance
- Competitive pricing
Wire type
Au, Ag, Cu, CuPd, alloy
Application
LED industry
Item | Parameter |
Bonding Technology | Thermosonic bonding |
Optics | Single Path |
Bonding Accuracy | ±3.0μm |
Bond area | 56 x 70mm |
Cycle time | 65ms/wire |
Wire diameter | 18μm-50μm |
Service Hotline
400-889-8833
粵公網(wǎng)安備 44070302000690號(hào)